InterFET Corporation是一家在德克萨斯州注册成立的私营公司。 InterFET是离散结型场效应晶体管（JFET），定制集成电路，混合集成电路（MCM-C）和相关半导体器件的领先制造商和全球供应商。

InterFET公司总部，运营和制造设施位于德克萨斯州Richardson的Glenville Dr 715，位于Dallas Metroplex。 InterFET产品应用包括组件和子组件计算机电路，医疗仪器和设备，用于各种模拟和数字应用的测试和测量仪器，防御系统，航空航天器，地球物理勘探仪器和消费产品。

InterFET的主要专长是设计，制造，并为客户问题提供创新和实用的解决方案。作为一家紧凑且反应迅速的公司，InterFET有能力满足客户的特殊产品要求，开发适销对路的新产品，并加强和扩大我们的行业标准类型的生产和分销。 InterFET具有18种不同的JFET几何形状和2000多种不同的部件类型，可提供业内最广泛的JFET。

InterFET的产品不断推动技术的性能极限，同时不会牺牲可接受的制造产量和相关的成本控制优势。

InterFET还生产厚膜混合集成电路或多芯片模块。该技术是将电子电路和系统小型化为小型单个器件封装。我们的主要客户在温度接近200摄氏度的非常恶劣的环境和高压应用中使用这些产品，例如石油勘探中的井下仪器。我们还提供特殊包装和多芯片模块的定制和小型原型组装。

InterFET Corporation is a privately held company incorporated in the State of Texas. InterFET is a leading manufacturer and global supplier of discrete Junction Field Effect Transistors (JFETs), Custom Integrated Circuits, Hybrid Integrated Circuits (MCM-C) and related semiconductor devices.

Corporate headquarters, operating, and manufacturing facilities are located at 715 N Glenville Dr,  Richardson, Texas, in the Dallas Metroplex. InterFET product applications include component and sub-assembly computer circuitry, medical instrumentation and devices, test and measurement instrumentation for a variety of analog and digital applications, defense systems, air and spacecraft, geophysical exploration instrumentation, and consumer products.

Our primary expertise is in design, manufacturing, and providing innovative and practical solutions to customer problems. A compact and responsive company, we are well positioned to respond to our customers' special product requirements, to develop marketable new products, and to strengthen and broaden our production and distribution of industry standard types. With over 18 different JFET geometries and 2000+ different part types, InterFET supplies the broadest range of JFET’s in the industry. 

Our products continually push the performance limits of technology, without sacrificing acceptable manufacturing yields and the associated cost control advantages.

InterFET also manufactures Thick Film Hybrid Integrated Circuits, or Multi-Chip Modules. This technology is the miniaturization of electronic circuits and systems to small single device packages. Our primary customers use these products in very harsh environments with temperatures approaching 200 Degrees C and high pressure applications such as down-hole instrumentation in oil exploration. We also offer custom and small run prototype assembly of special packaging and multi-chip modules.